Мicrostrip boards for microwave units

   ELSYS manufactures and delivers microstrip boards for microwave units on substrates of polycristalline high-alumina corundum material ( 99,8 % Al2O3 ) with high physical, chemical and electrical properties.
   ELSYS manufactures microstrip boards of any pattern measuring up to 60 x 48mm with thicknesses 0.5, 1.0, 2.0 mm to customer’s drawings:

- with semiconductor microwave components;

- with semiconductor and resistor microwave components;

- with plated–through and non plated holes of any pattern.

Physical, chemical and electrical properties of substrates:

Parameters

Value

Density, g/cm3

3,98

Center–symmetric bending strength, kgf/cm2

3200

Thermal conductivity, kcal/cm*sec*degree

83

Temperature coefficient of linear expansion in the temperature range from 20 to 900 оС

80*10-7

Porosity, %, max.

0,5

Dielectric constant in the frequency range from 8 to 10 GHz at 20 оС

9,6

Electrical volume resistance at 150 оС, ohm*cm, min.

2*1014

Physical, chemical and electrical properties of resistors:

Parameters

Value

Surface resistivity, Kohm/square

0,05-2,0

Thickness, ?m

0,015-0,3

Temperature coefficient of resistance in the temperature range from minus 60 to +120 оС

2*10-4

Allowable power dissipation, W/cm2, max.

5

Irreversible resistance change after 1000 hr operation under 1 W/cm2 dc load at 85 оС, %, max.

1

Metallization systems:

System

Thickness of the main conducting layer, ?m

Minimum component size, ?m

 

Notes

Cr-Cu-Ni-Au

5-10 Cu

50-80

Most frequently used, low resistivity, good microwave properties

Ti-Pd-Au

5 Au

50

High thermal stability, corrosion resistance

Al

5 Al

50

For single-layer structures
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